Specifications

System Components

Redundant, hot-swappable components, designed for no single point of failure

  1. 3U JBOD enclosure
  2. Single or dual SES monitoring modules
  3. 16 drive trays
  4. Dual redundant power supplies
  5. 2 hot-swappable fan modules
  6. 2 hot-swappable expansion port modules
Management
  1. Centralized management of multiple arrays over in-band or Ethernet
  2. Enclosure status report through Fibre loop connection
  3. Auto on-lining of cascaded enclosures
  4. Module status indicators, onboard alarm, events reported to RAID controllers
Host/Drive Interface
  1. 3.5", 1" high disk drives
  2. 16 hot-swappable drive trays
  3. Single dual loop across 16 drives within enclosure
  4. Auto-negotiate and full-duplex 2Gb FC-AL

Physical/Electrical

Interfaces

4 SFP sockets using a short-wavelength adapter

Power supply

2 redundant, hot-swappable power supplies with PFC

Cooling fan
  1. 4 cooling fans in two separate modules:
  2. Operating temperature: 5 to 40°C
  3. Non-operating temperature: - 40º to 60ºC
  4. Relative humidity: 10~95%, non-condensing
  5. Operating altitude: sea level to 10,000ft
Dimensions
  1. Chassis dimensions: 131H x 446.2W x 500D mm
  2. (w/ protrusions): 131H x 485W x 532D mm
  3. Package dimensions: 476H x 592W x 695D mm
System weight (w/o drives)
  1. Net weight: 20kg
  2. Gross weight: 32k