Specifications

System Components

Redundant, hot-swappable components, designed for no single point of failure

1. 3U JBOD enclosure
2. Single or dual SES monitoring modules
3. 16 drive trays
4. Dual redundant power supplies
5. 2 hot-swappable fan modules
6. 2 hot-swappable expansion port modules

Management

1. Centralized management of multiple arrays over in-band or Ethernet
2. Enclosure status report through Fibre loop connection
3. Auto on-lining of cascaded enclosures
4. Module status indicators, onboard alarm, events reported to RAID controllers

Host/Drive Interface

1. 3.5", 1" high disk drives
2. 16 hot-swappable drive trays
3. Single dual loop across 16 drives within enclosure
4. Auto-negotiate and full-duplex 2Gb FC-AL

Physical/Electrical

Interfaces

4 SFP sockets using a short-wavelength adapter

Power supply

2 redundant, hot-swappable power supplies with PFC

Cooling fan

1. 4 cooling fans in two separate modules:
2. Operating temperature: 5 to 40°C
3. Non-operating temperature: - 40º to 60ºC
4. Relative humidity: 10~95%, non-condensing
5. Operating altitude: sea level to 10,000ft

Dimensions

1. Chassis dimensions: 131H x 446.2W x 500D mm
2. (w/ protrusions): 131H x 485W x 532D mm
3. Package dimensions: 476H x 592W x 695D mm

System weight (w/o drives)

1. Net weight: 20kg
2. Gross weight: 32k